• IC Substrate (BGA, FC, CSP) Products
    F30P Micro Bore Diameter /Multiple Bores High-Accuracy Drilling Processing Instruction 

    High-speed Spindle  Model: F30P
    >Processing efficiency upgrades by 20~30% (ND-Ni TYPE/H920B Modification)
    >Corresponding to small-diameter processing fields (Drill diameter: φ0.15mm below)

    small-diameter processing bore quality UP  Model: DDH (CCD)
    >ensuring the processing accuracy

    Output Upgrading
    >small-diameter Drill Life 200% UP
    >Processing conditions Feed rate UP
    >Number of processing PCB pieces UP

    F30P Spindle Equipping

     
    Technology Roadmap for PCB Industry

    Processing Accuracy and Efficiency Upgrading
    Spindle model No : F30P

    Drill diameter φ0.1mm
    Substrate thickness--0.1mm (BT-NX A-HS Cu5um)
    Total number of processing bores 300,000 bores
    Machine HITACHI ND-6N210E/M-30D
    200kprm Processing conditions Spindle speed--200Krpm, drilling speed--1.65 m/min, operating life--4,000 bores
    300kprm Processing conditions Spindle speed--300Krpm, drilling speed--1.90 m/min , operating life--4,000 bores

    F30 P Corresponding Specification: Shank φ3.175mm, φ2.0mm / Ring Less (ring less specification)

    Processing Efficiency and Consumables’ Operating Life—UP

    Drill diameter φ0.15mm
    Substrate thickness 0.8mm (BT-HL832 NX A-EX Cu9um)*2-piece drill
    Total number of processing bores 250,000 bores
    Machine HITACHI ND-6N210E/M-30D
    200kprm Processing conditions Spindle speed--200Krpm, drilling speed--2.0 m/min, operating life--3,000 bores
    300kprm Processing conditions Spindle speed--300Krpm, drilling speed--3.0 m/min, operating life--6,000 bores